Title:  Senior Specialist, Electrical Engineer- Mixed-Signal DSP Hardware Engineer

Job Title: Senior Specialist, Electrical Engineer- Mixed-Signal DSP Hardware Engineer

Job Code: 46257
Job Location: San Diego, CA
Job Schedule: 9/80 1st Shift

Job Description:

L3Harris is seeking a Senior Hardware Engineer to develop mixed-signal, high-speed digital, and DSP-oriented hardware for Tracking, Telemetry, and Command products used in airborne and space-based electronic systems. The role includes architecture, detailed design, verification, troubleshooting, integration, and production support for converter-based receiver, transmitter, direct-conversion, and modem subsystems incorporating high-speed ADCs, DACs, AFEs, PLLs, clock distribution, FPGA or ASIC interfaces, power supplies, and GHz-class signal interfaces. The ideal candidate will bring strong expertise in timing, synchronization, throughput, signal integrity, power integrity, noise performance, and hardware/software partitioning across modem and signal-processing systems.

Essential Functions:

• Lead the design and development of mixed-signal, high-speed digital, and DSP hardware for advanced electronic systems, including receiver, transmitter, direct-conversion, and modem signal chains, with responsibility for architecture, schematic capture, component selection, derating, worst-case analysis, and hardware documentation.
• Design hardware that supports or implements DSP functions, including high-speed digital data paths, converter interfaces, synchronization, and throughput-critical processing chains, and optimize digital hardware platforms used to execute, accelerate, or interface with DSP algorithms.
• Guide PCB layout and board-level implementation for high-speed mixed-signal designs, including stack-up definition, placement, controlled impedance, grounding, isolation, power distribution, and design considerations for signal integrity, power integrity, dynamic range, jitter, phase noise, and overall noise performance.
• Conduct trade studies, simulations, hardware bring-up, debugging, design verification, and troubleshooting to the component level to support architecture selection, clocking strategy, hardware/software partitioning, and product performance through integration, test, manufacturing, and production.
• Collaborate closely with FPGA, ASIC, RF, DSP, software, systems, mechanical, and manufacturing engineering teams, and provide technical leadership and mentoring to junior engineers.

Qualifications

• Bachelor’s degree in Electrical Engineering or related field with 6+ years of prior related experience, or Graduate degree with 4+ years of prior related experience.
• Active Secret security clearance

Preferred Additional Skills

• Experience designing mixed-signal and high-speed digital hardware using ADCs, DACs, AFEs, FPGA interfaces, ASIC interfaces, and high-speed digital data paths, including hardware that supports or implements DSP functions.
• Strong understanding of direct-conversion, modem, and related communications and signal-processing architectures, including timing, synchronization, clocking, throughput, and converter interfaces such as JESD204.
• Experience optimizing hardware platforms for DSP algorithms and working at the hardware/software boundary, including partitioning functions across hardware, programmable logic, embedded processing, and software-defined modem implementations.
• Experience with signal integrity, power integrity, low-noise power design, and GHz-class board-level implementation, including design and implementation of point-of-load power supplies for FPGAs, ADCs, DACs, AFEs, and other high-performance devices.
• Familiarity with RF principles as applied to converter-based and high-frequency modem systems.
• Experience with schematic capture, design analysis, laboratory debug, and design verification testing.
• Strong communication skills and ability to work effectively in a multidisciplinary engineering environment.
• Experience with direct RF sampling, integrated AFEs, modern converter-based system architectures, PLLs, synthesizers, jitter-cleaning clocks, clock buffering, and phase-coherent timing systems.
• Experience with SI/PI simulation, PCB layout guidance for high-speed mixed-signal hardware, and familiarity with performance metrics such as EVM, SNR, SFDR, ENOB, phase noise, I/Q imbalance, and LO leakage.
• Experience with RF and high-frequency modem architecture, DSP integration, partitioning of functions between hardware, FPGA or ASIC resources, firmware, and software, and modem implementation as part of a complete communications subsystem.
• Experience supporting high-reliability, military, or aerospace hardware development.

In compliance with pay transparency requirements, the salary range for this role in California is $106,500 - $197,500. This is not a guarantee of compensation or salary, as final offer amount may vary based on factors including but not limited to experience and geographic location. L3Harris also offers a variety of benefits, including health and disability insurance, 401(k) match, flexible spending accounts, EAP, education assistance, parental leave, paid time off, and company-paid holidays. The specific programs and options available to an employee may vary depending on date of hire, schedule type, and the applicability of collective bargaining agreements.