Title:  Manager, Mechanical Engineering

Job Title: Manager, Mechanical Engineer

Job Code: 23898

Job Location: Salt Lake City, UT

Job Schedule: 9/80

Job Description:

Seeking a Staff Level Mechanical Engineering Manager for the Environmental Analysis Team, within Hardware Engineering. Successful candidates will lead members of a highly motivated, multi-disciplined, cross-functional design and analysis team. 

Essential Functions:

• Lead a team of design engineers and analysts, in developing, analyzing, building, and testing electronic packaging concepts.  Incorporating advanced heat management technologies.  Design for shock and vibration typical of military grade ruggedized electronics.
• Lead, train, and mentor new team members.  Develop analysis guidelines, methods, and tools to increase analysis efficiency.
• Ensure team members designs progress according to technical objectives, within budgetary and schedule constraints.
• Participate in various university collaboration efforts for graduates and undergraduates.
• Pursue advanced technology IRAD (Internal Research and Development) funding to develop new and innovative enabling technologies. 
• Assisting in specification creation, architecture determination, proposals, and presentations to customers and executives.
• Developing innovative electromechanical packaging solutions that achieve design objectives while simultaneously satisfying multiple design constraints. 
• Have an ability to work across multiple functional domains with operations, systems, quality, and program management. 
• Communicate technical concepts with both technical and non-technical audiences both in person and in writing.

Required Qualifications: 

• Bachelor’s Degree and minimum 9 years prior related experience. Graduate Degree with a minimum of 7 years of prior related experience. In lieu of a degree, minimum of 13 years of prior related experience

Preferred Additional Skills:

• Candidate must have experience managing a team, evaluating performance, and having critical conversations when necessary. 
• Working knowledge and experience with FEA theory.
• Thorough knowledge of internal design processes and procedures P-652, G-654, etc.
• Thorough knowledge of internal Mechanical Engineering Guidelines (MEGA) for Analysis is a must.
• Experience with additive manufacturing (FDM, MJF, DMLS) is a required. 
• Ability to work across functional organizations outside of Hardware Engineering.
• Proficient in CAD and drafting standards. 
• Experience with environmental testing, i.e., shock, vibration, temperature/altitude, environmental stress screening (ESS), Sand and Dust, Humidity, Rain/Snow, Solar radiation.
• Proficient with electronics cooling methods and strong background in heat transfer (conduction, convection, radiation) applied to electronics packaging and reliability.
• ANSYS or FLOEFD experience preferred. 
• Experience with Topology optimization is a plus.
• Experience plating of polymers for ruggedized environments is a plus. 
• Siemens’ NX, preferred.  Experience with Space Claim a plus. 
• Familiarity with Open Standards: VITA, VME, PMC and mixed signal board design (RF and Digital) is preferred.

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