Title:  Specialist, Microelectronics Advanced Packaging Designer

Job Title: Specialist, Microelectronics Advanced Packaging Designer – Tapeout  

Job Code: 16329

Job Location:  Palm Bay, FL

Job Schedule: 9/80 (Every other Friday off!)

Relocation: Relocation assistance is available to qualified applicants! 

Job Description:

The L3Harris Space and Airborne Systems Microelectronics organization is expanding our in-house advanced packaging research and development efforts and capabilities. As a member of our dynamic and collaborative environment, you will be responsible for working with EDA tools to solve challenging layout problems at the silicon level. 

Essential Functions: 

• Write and modify DRC and LVS rule deck in PVS or Calibre for silicon tapeout.
• Write Cadence SKILL routines for Virtuoso, APD, and general programming.
• Develop custom checks as needed for verification and robustness.
• Work with GDS and OAS file formats and translators.
• Work closely with advanced packaging design team to improve design tools and submit bug findings and improvement recommendations.
• Adapt to an evolving process and work closely with teammates providing up-to-date changes.

Qualifications:

• Bachelor’s Degree in Electrical Engineering and a minimum of 4 years of prior related experience. Graduate Degree or equivalent with 2 years of prior related experience. In lieu of a degree, minimum of 8 years of prior related experience
• Experience with hierarchical design editing in EDA tools including Virtuoso, K-Layout, and/or L-Edit
• Professional knowledge of coding in Python and/or MATLAB
• Experience with foundry design rules encompassing minimum line widths, spaces, angles, and degassing
• Professional experience with 3D layouts

Preferred Additional Skills:

• Existing TS/SCI Clearance or ability to obtain one