Title:  Specialist, Mechanical Engineering - Thermal Analyst

Job Title: Specialist, Mechanical Engineering – Thermal Analyst

Job Code: 43445

Job Location: Palm Bay, FL

Job Schedule: 9/80: Employees work 9 out of every 14 days – totaling 80 hours worked – and have every other Friday off

Job Description:

The Military Avionics group specializes in developing disruptive, next-generation technologies for military aircraft using small company agility and big company experience.  Team is seeking an Electronic Packaging Mechanical Engineer specializing in thermal analysis to work with a cross-functional team to assist development, design, and implementation of avionics electronic systems.  We are seeking a self-motivated individual contributor with strong thermal analysis skills.  The position will follow the product from conceptualization through hardware integration and test, executing the thermal analysis.  In this role you will perform analysis of avionics electronics equipment using first order thermodynamics and fluid mechanics principles, along with conjugate heat transfer simulations (CFD), to predict system and component level thermal responses. The position will interface with Designers, Thermal/Structural Analysts, Systems Engineers, other engineering disciplines, Program Managers, and customer counterparts. The position will require giving input to portions of the mechanical engineering activities related to the design, analysis, documentation, fabrication, assembly and qualification of product to the specification requirements, typically with stringent technical, schedule, and process requirements as well as supporting thermal qualification testing. Candidate must have experience in CFD software and be able to work under moderate supervision on tasking that is typically assigned with high level requirements. Candidate must have the ability to work independently and within a multi-disciplined team environment. 

Essential Functions:

• Works under general supervision on tasking that is typically assigned with high level requirements, may be responsible for entire projects within job area. Some derivation of requirements may be required to support the design.
• Leverages prior experience to support designs. Actively seeks feedback from SME's and other knowledgeable colleagues as needed.
• Knows when to question requirements to determine real product needs
• Actively seeks out information by interfacing with external disciplines as required to accomplish assigned tasking
• Assists with new hire and intern onboarding, including support of career fairs and university outreach. Communicates applicable processes and standard operating procedures as well as their importance and benefits.
• Establishes working relationships in other disciplines and departments such as operations, quality, and procurement
• Effectively documents and communicates design intent.
• Provides regular status reporting of accomplishments, issues, and challenges as well as potential risks directly applicable to current tasking
• Demonstrated ability and creativity to propose multiple conceptual design solutions
• Uses knowledge and experience to derive requirements and make technical assumptions, typically within own discipline but also providing input to other disciplines
• Supported by experienced team members for guidance and feedback
• Supports execution of tasking that may be critical to the success of the program
• Identifies issues or risks relative to direct tasking and proactively alerts team leadership
• Directly contributes to the achievement of critical milestones associated with specific projects (PDR, CDR, TRR, etc)
• Schedule, cost, and technical input at the major subsystem level
• Identifies and submits process improvement initiatives relevant to daily work
• Responsible to direct and review the work of new graduate engineers and designers and technicians.
• Exhibits a high level of engagement and ownership in the successful completion of assigned tasking
• Ability to obtain US government security clearance

Qualifications:

• Bachelor’s Degree and minimum 4 years of prior relevant experience. Graduate Degree and a minimum of 2 years of prior related experience. In lieu of a degree, minimum of 8 years of prior related experience.

Preferred Additional Skills:

• First order analysis of heating/cooling thermal management systems (conduction, convection). I.E Heat Transfer 101
• Experience in CFD software packages: FloTHERM is preferred. Ansys, Icepack, StarCCM, OpenFOAM, etc. acceptable.
• 2+ years experience in thermal analysis for packaging electronics including design for and testing to military environments (i.e. temperature, vibration, shock, etc.)
• Experience in 3D CAD modeling – PTC Creo, Catia, NX, Fusion 360,  Solidworks, etc.
• Excellent people skills, with experience working and collaborating in a multi-disciplinary, diverse, and dynamic team environment.
• Excellent communication skills (written, verbal, & presentation)
• Strong hands-on capabilities, to include integration of mechanisms and products.

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