Job ID:  30051

Title:  Senior Associate Engineering Services

Location: 

Palm Bay, FL, US, 32905

Job Title: Microelectronics Lab Support, Engineering Services

Job Code: 30051

Job Location: Palm Bay, Florida  

Job Description: L3Harris is searching for a talented individual to work in a hands-on microelectronics engineering environment providing processing, assembly, and metrology services and development.  Supporting activities include working independently and problem solving around a variety of microelectronics processes including laser machining, high magnification microscope inspection for extended periods, ultrasonic imaging, and precision diamond sawing.   

 

Essential Functions: 

  • Perform high magnification inspection, measure critical dimensions, identify defects, and report defects to responsible work cells so yield can be enhanced
  • Operate and program various types of high precision manufacturing tools.
  • Develop and build engineering development vehicles as well as deliverable products to work instructions, workmanship standards and assembly drawings.
  • Develop new processes and work instructions for engineering development vehicles and deliverable products.
  • Work independently in a dynamic environment.
  • Interact with team members, customers, and vendors. Explain and interpret processes to internal customers.
  • Provide regular status and tracking of engineering development work throughput to program leadership and internal customers.
  • Plan tasking and objectives for support team members within work cell.

 

Qualifications:

  • Bachelor’s Degree and a minimum of two (2) years of prior related experience. Graduate Degree or equivalent with zero (0) to two (2) years of prior related experience. In lieu of a degree, minimum of six (6) years of prior related experience.
  • Ability to write work instructions and database entry
  • Minimum two (2) years experience conducting work using a microscope.
  • Minimum two (2) years of experience operating and programming motion-controlled manufacturing tools including dicing saws, laser cutting, adhesive dispense systems, and/or wire bonders.

 

Preferred Additional Skills:

 

  • Semiconductor wafer processing and handling experience.
  • Industrial electromechanical and high-vacuum equipment maintenance, troubleshooting, and repair experience.
  • Dimensional measurement using an optical microscope.
  • Chemical handling experience (solvents & acids).

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