Job Title: Lead, PCB Design – Signal Integrity/Stackup Specialist 

Job Code: 46234

Job Location: Palm Bay, FL, Carlsbad, CA or Herndon, VA

Job Schedule: 9/80: Employees work 9 out of every 14 days – totaling 80 hours worked, and have every other Friday off    

Job Description:

L3Harris has an immediate need for a Signal Integrity/Stackup PCB Design Specialist whose role defines and optimizes rigid, rigid-flex, and multilayer PCB stackups for signal integrity, power integrity, impedance control, EMI/EMC, thermal performance, and fabrication constraints.

You will work closely with electrical, RF, mechanical, layout, and manufacturing teams to translate CCA  requirements into practical, production-ready signal integrity and board-layer strategies. This is a hands-on PCB design role with particular ownership of stackup definition, impedance planning, and stackup-related layout guidance.  Team members will collaborate closely with electrical engineers, mechanical engineers, and manufacturing teams to ensure high-quality, reliable designs that meet performance and cost objectives.

Essential Functions:

• Design and document rigid, rigid-flex, and multilayer PCB stackups for high-speed, mixed-signal, RF, and power applications.
• Define controlled-impedance structures, dielectric materials, copper weights, layer assignments, and via strategies.
• Partner with electrical engineers to translate Signal Integrity(SI)/Power Integrity(PI) requirements into practical routing rules, return-path planning, reference-plane strategy, grounding, shielding, and layer-transition guidance.
• Evaluate stackup tradeoffs across electrical performance, EMI/EMC, thermal needs, mechanical requirements, cost, and manufacturability.
• Collaborate with PCB fabricators to validate materials, impedance coupons, fabrication tolerances, bend-region constraints, and production capability.
• Review PCB layouts and fabrication packages for stackup-related risks and provide clear corrective guidance.
• Maintain stackup drawings, impedance tables, fabrication notes, material specifications, and revision history.
• Support prototype and production issue resolution involving impedance, crosstalk, loss, resonance, warpage, or EMI.
• Developing rigid, rigid-flex, and multilayer PCB stackups for high-speed, RF, mixed-signal, or high-power products.
• Strong understanding of controlled impedance, transmission lines, return paths, dielectric properties, copper roughness, insertion loss, and crosstalk.
• Developing stackup requirements to PCB layout, including layer usage, differential-pair routing, via transitions, reference planes, and high-speed design constraints.
• Knowledge of rigid and rigid-flex PCB fabrication processes, materials, bend-region constraints, and manufacturer 
• Work directly with PCB fabricators and clearly communicating stackup, impedance, and material requirements.

Required Qualifications:

• Bachelor’s Degree and minimum 9 years of prior relevant experience. Graduate Degree and a minimum of 7 years of prior related experience. In lieu of a degree, minimum of 13 years of prior related experience.

Preferred Additional Skills:

• Proficiency with Siemens Xpedition PCB design or experience with similar tools.
• Experience using Siemens HyperLynx Z-planner for PCB stackup design.
• Experience with DDR, PCIe, USB, Ethernet, SerDes, RF, or high-current power-delivery designs.
• Cadence Allegro and Altium PCB experience.
• Experience designing multilayer printed circuit boards for radio-frequency or mixed-signal applications.
• Familiarity with Design for Manufacturability (DFM) and Design for Testability (DFT) principles.
• Experience with three-dimensional mechanical integration and electromagnetic-compatibility considerations.
• Familiarity with product lifecycle management (PLM) systems and engineering configuration-control processes.
• IPC Certified Interconnect Designer (CID/CID+)

In compliance with pay transparency requirements, the salary range for this role in California and in Virginia - Greater Washington, D.C. area is $110,500- $205,000 . This is not a guarantee of compensation or salary, as final offer amount may vary based on factors including but not limited to experience and geographic location. L3Harris also offers a variety of benefits, including health and disability insurance, 401(k) match, flexible spending accounts, EAP, education assistance, parental leave, paid time off, and company-paid holidays. The specific programs and options available to an employee